InterPACK 2025: Packaging and Integration of Electronic and Photonic Microsystems

Name: InterPACK 2025: Packaging and Integration of Electronic and Photonic Microsystems
Start: 2025-10-28T08:00:00-07:00
End: 2025-10-30T17:00:00-07:00
Location: Hotel Fera, a DoubleTree by Hilton

ASME (American Society of Mechanical Engineers)

Highlights

Tue, 28 Oct, 2025 at 08:00 am

Hotel Fera, a DoubleTree by Hilton

Date & Location

Tue, 28 Oct, 2025 at 08:00 am - Thu, 30 Oct, 2025 at 05:00 pm (PDT)

Hotel Fera, a DoubleTree by Hilton

100 The City Drive, Orange, California, United States

About the event

InterPACK 2025: Packaging and Integration of Electronic and Photonic Microsystems

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.

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