# Event Details - **Event Name**: 37th Annual Electronics Packaging Symposium- Small Systems Integration - **Event Start and End Date**: Wed, 09 Sep, 2026 at 07:30 am – Thu, 10 Sep, 2026 at 05:00 pm (-04:00) - **Event Description**: GE Research, IBM Research, IEEC and CAMM at Binghamton University are proud to host the 37th Annual Electronics Packaging SymposiumAbout this EventIBM Research, GE Aerospace, IEEC and CAMM at Binghamton University invite you to attend this two-day event on September 9 and 10, 2026 at the Center of Excellence at Binghamton University in Binghamton NY. Registration closes on August 31 2026, no walk-ins are allowed.The theme of this years symposium is a focus on packaging for Artificial Intelligence. Artificial Intellligence has been driving the industry for the last couple of yaars, we have seen how AI models require massive amounts of energy to process. Many of the new AI processors are designed to consume 1000 watts or more. This presents challenges in thermal management as well as substrate and interconnect design to properly deliver the power to the devices.Our two keynotes from Samsung and AMD will describe the challenges and some possible solutions to these packaging challenges. Moving to the sesions, many of our speakers will also be discussing topics related to AI packaging.This symposium brings together leaders in academia, industry and government to discuss electronics packaging topics.• Future of Computing for HPC and AI• Photonics Packaging• Power Electronics• Thermal Challenges / Harsh Environments• Flexible & Additive Electronics• Heterogeneous Integration• Advance Substrates• Wearable and Flexible Electronics for Medical ApplicationsAgenda : Join us for two days filled with exciting discussions, workshops, and networking opportunities in the field of electronics packaging. Learn from industry experts, researchers, and fellow enthusiasts as we delve into the latest trends and innovations shaping the future of electronic packaging. Whether you're a seasoned professional or just starting out, this symposium promises to be a valuable experience for all attendees. Don't miss out on this fantastic opportunity to expand your knowledge and connect with like-minded individuals. See you there!You can view the speaker list here:Travel and Hotel information here: (discounted room rates expire August 9, 2026)If you have any questions, please contact us at: epsympos@binghamton.eduREGISTER TODAY and join a community which seeks advancement in the electronics packaging field. We look forward to seeing you this fall.Sincerely,2026 EPS Organizing Committee - **Event URL**: https://allevents.in/vestal/37th-annual-electronics-packaging-symposium-small-systems-integration/100001987088141121 - **Event Categories**: workshops, it, artificial-intelligence - **Interested Audience**: - total_interested_count: 0 - **Event Highlights**: - Duration: 9 hours 30 minutes - Location: Binghamton University - Languages: English ## Ticket Details - **Ticket Price Range**: min: 0, max: 2500, currency: USD ## Event venue details - **city**: Vestal - **state**: NY - **country**: United States - **location**: Binghamton University - **lat**: 42.0940904 - **long**: -75.9583304 - **full address**: Binghamton University, 85 Murray Hill Road, Vestal, United States ## Event gallery - **Alt text**: 37th Annual Electronics Packaging Symposium- Small Systems Integration - **Image URL**: https://cdn-az.allevents.in/events9/banners/e33aa5acbf9a15cd7cf009b3180d5036d4fe001559106d52b6f66fded79071a1-rimg-w1200-h600-dc016346-gmir.jpg?v=1780683733 ## FAQs - **Q**: When and where is 37th Annual Electronics Packaging Symposium- Small Systems Integration being held? - **A:** 37th Annual Electronics Packaging Symposium- Small Systems Integration takes place on Wed, 09 Sep, 2026 at 07:30 am to Thu, 10 Sep, 2026 at 05:00 pm at Binghamton University, 85 Murray Hill Road, Vestal, United States. - **Q**: Who is organizing 37th Annual Electronics Packaging Symposium- Small Systems Integration? - **A:** 37th Annual Electronics Packaging Symposium- Small Systems Integration is organized by Integrated Electronics Engineering Center (IEEC). - **Q**: Who is this event for? Is it right for me? - **A:** 37th Annual Electronics Packaging Symposium- Small Systems Integration is ideal for curious learners, students, and skill-builders looking to gain hands-on knowledge and practical expertise in a focused, interactive setting. Whether you're a first-time attendee or a longtime enthusiast in Vestal, this event is thoughtfully curated to deliver a standout experience worth every moment. 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