# Event Details

- **Event Name**: InterPACK 2026: Packaging and Integration of Electronic and Photonic Microsystems
- **Event Start and End Date**: Mon, 26 Oct, 2026 at 08:00 am – Thu, 29 Oct, 2026 at 05:00 pm (-07:00)
- **Event Description**: InterPACK is the leading global forum for cutting‑edge research, development, manufacturing, and applications in electronics packaging and heterogeneous integration.

As the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD), InterPACK brings together the full systems ecosystem — from advanced materials and thermal management to next‑generation computing architectures and intelligent, connected devices. The program spans Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive and Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid, and Electric Vehicles.


https://event.asme.org/InterPACK?utm_medium=social&utm_source=facebook&utm_audience=b2c&utm_dept=cf&utm_campaign=interpack_cfa_organicsocial
- **Event URL**: https://allevents.in/san-diego/interpack-2026-packaging-and-integration-of-electronic-and-photonic-microsystems/200030626414901
- **Event Categories**: business, it, conferences
- **Interested Audience**: 
  - total_interested_count: 8

## Ticket Details


## Event venue details

- **city**: San Diego
- **state**: CA
- **country**: United States
- **location**: San Diego Marriott Mission Valley
- **lat**: 32.775408462489
- **long**: -117.13995337486
- **full address**: San Diego Marriott Mission Valley, 8757 Rio San Diego Drive,San Diego,CA,United States

## Event gallery

- **Alt text**: InterPACK 2026: Packaging and Integration of Electronic and Photonic Microsystems
  - **Image URL**: https://cdn-az.allevents.in/events8/banners/ca9e7d1c842fc1e523b3e4ad323b46eade040591cbd96b3ae49aa4783cfbeb9b-rimg-w1200-h628-dc080818-gmir?v=1787943119

## FAQs

- **Q**: When and where is InterPACK 2026: Packaging and Integration of Electronic and Photonic Microsystems being held?
  - **A:** InterPACK 2026: Packaging and Integration of Electronic and Photonic Microsystems takes place on Mon, 26 Oct, 2026 at 08:00 am to Thu, 29 Oct, 2026 at 05:00 pm at San Diego Marriott Mission Valley, 8757 Rio San Diego Drive,San Diego,CA,United States.
- **Q**: Who is organizing InterPACK 2026: Packaging and Integration of Electronic and Photonic Microsystems?
  - **A:** InterPACK 2026: Packaging and Integration of Electronic and Photonic Microsystems is organized by ASME (American Society of Mechanical Engineers).
- **Q**: Who is this event for? Is it right for me?
  - **A:** InterPACK 2026: Packaging and Integration of Electronic and Photonic Microsystems is ideal for art lovers, trade professionals, collectors, and exhibition enthusiasts exploring the latest in their field. Whether you're a first-time attendee or a longtime enthusiast in San Diego, this event is thoughtfully curated to deliver a standout experience worth every moment. If InterPACK 2026: Packaging and Integration of Electronic and Photonic Microsystems sounds like your kind of event, don't wait - spots fill up fast.

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