FREE EVENT - The Sticky Business
Structural adhesive bonding is used in many critical applications, but the performance of such joints relies on the integrity of the bond between adhesive and substrate. Such bonding involves layers only a few atoms thick and this talk will consider how surface chemical analysis methods (X-ray photoelectron spectroscopy and time-of-flight secondary ion mass spectrometry) are able provide us with analytical information which will lead to optimum performance in the most demanding of applications.
Approaching the buried interface is necessarily complex and involves a degree of innovation in sample preparation. Methods developed at the University of Surrey over the last four decades will be described.