# Event Details - **Event Name**: 2026 Int'l Conference Embedded Systems, Mobile Communication and Computing - **Event Start and End Date**: Tue, 13 Jan, 2026 at 09:00 am – Tue, 13 Jan, 2026 at 05:30 pm - **Event Description**: EMC² 2026 will be held on January 12-14, 2026 in Hong Kong, ChinaAbout this EventIEEE 2026 International Conference on Embedded Systems, Mobile Communication and Computing (EMC²2026) will be held on January 12-14, 2026 in Hong Kong, China.**TICKETS NOT SOLD THROUGH EVENTBRITE, PLEASE USE LINK TO THE WEBSITE BELOWConference Website: ---Call for papers---The topics of interest for submission include, but are not limited to:1. Internet of Things (IoT) and Embedded Systems2. Embedded Processors and System-on-Chip (SoC) Design3. TinyML Applications on Embedded IoT Nodes4. Embedded Sensing and Perception Systems5. Edge-Al Healthcare and Wearable Devices6. Mobile Intelligent Devices and Human-Machine Interaction7. Smart Cities and Intelligent Transportation with Embedded Systems7. Industrial IoT and Cybersecure Embedded Archi-tectures8. Collaborative Robotics and Autonomous Embedded Systems......---Publication---All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published by IEEE(ISBN: 979-8-3315-7708-7) and will be submitted to IEEE Xplore, EI Compendex, Scopus for indexing.---Important Dates---Full Paper Submission Date: November 11, 2025Registration Deadline: December 1, 2025Final Paper Submission Date: December 16, 2025Conference Dates: January 12-14, 2026--- Paper Submission---Please send the full paper(word+pdf) to Submission System: - **Event URL**: https://allevents.in/hong-kong/2026-intl-conference-embedded-systems-mobile-communication-and-computing/100001913374658109 - **Event Categories**: business, conferences, it - **Interested Audience**: - total_interested_count: 0 ## Ticket Details - **Ticket URL**: https://consumer.pxf.io/c/1339408/3151484/39691?partnerpropertyid=1191892&MediaPartnerPropertyId=1191892&svlink=14105511&level=1&u=https%3A%2F%2Fwww.eventbrite.com%2Fe%2F2026-intl-conference-embedded-systems-mobile-communication-and-computing-tickets-1913374658109 - **Ticket Price Range**: min: 0, max: 0, currency: USD ## Event venue details - **city**: Hong Kong - **state**: HK - **country**: Hong Kong - **location**: The University of Hong Kong - **lat**: 22.2679201 - **long**: 114.1290719 - **full address**: The University of Hong Kong, Pok Fu Lam, Hong Kong ## Event Organizer details - **affiliate_id**: 10 - **organizer**: Aischolar (https://allevents.in/org/aischolar/26708523) ## Event gallery - **Alt text**: banner - **Image URL**: https://cdn-az.allevents.in/events7/banners/73949309586f31db2d768462bdaf73cb47a031176b32b07b01109f0233bff45c-rimg-w1200-h2743-dcc1d8da-gmir.jpg?v=1762097000 - **Alt text**: thumbnail - **Image URL**: https://cdn-az.allevents.in/events7/banners/4c8fe5e40a47af6ee38e775b131a882a111d1327a486a1a8d717ad4df36abddd-rimg-w400-h400-dcdcf4f6-gmir.jpg?v=1762096999 ## FAQs - **Q**: When is the event happening? - **A:** Tue, 13 Jan, 2026 at 09:00 am - **Q**: Where is the event happening? - **A:** The University of Hong Kong, Pok Fu Lam, Hong Kong - **Q**: What is the ticket price? - **A:** starting from 0 up to 0 USD - **Q**: Who is organizing the event? - **A:** Aischolar - **Q**: What type of event is this? - **A:** business, conferences, it - **Q**: Where can I find ticket details about 2026 Int'l Conference Embedded Systems, Mobile Communication and Computing ? - **A:** You can find ticket details about this event on AllEvents. ## Structured Data (JSON-LD) ```json [ { "@context": "https://schema.org", "@type": "Event", "name": "2026 Int'l Conference Embedded Systems, Mobile Communication and Computing", "image": "https://cdn-az.allevents.in/events7/banners/73949309586f31db2d768462bdaf73cb47a031176b32b07b01109f0233bff45c-rimg-w1200-h2743-dcc1d8da-gmir.jpg?v=1762097000", "startDate": "2026-01-13", "endDate": "2026-01-13", "url": "https://allevents.in/hong-kong/2026-intl-conference-embedded-systems-mobile-communication-and-computing/100001913374658109", "location": { "@type": "Place", "name": "The University of Hong Kong", "address": { "@type": "PostalAddress", "streetAddress": "Pok Fu Lam, Hong Kong", "addressLocality": "Hong Kong", "addressRegion": "HK", "addressCountry": "HK" }, "geo": { "@type": "GeoCoordinates", "latitude": "22.2679201", "longitude": "114.1290719" } }, "eventAttendanceMode": "https://schema.org/OfflineEventAttendanceMode", "description": "EMC² 2026 will be held on January 12-14, 2026 in Hong Kong, China", "offers": [ { "@type": "AggregateOffer", "availability": "https://schema.org/InStock", "priceCurrency": "USD", "availabilityStarts": "2026-04-04", "availabilityEnds": "2026-01-13", "validFrom": "2026-04-04", "lowPrice": "0.00", "highPrice": "0.00", "price": "0.00", "url": "https://allevents.in/hong-kong/2026-intl-conference-embedded-systems-mobile-communication-and-computing/100001913374658109" }, { "@type": "Offer", "availability": "https://schema.org/InStock", "priceCurrency": "USD", "availabilityStarts": "2026-04-04", "availabilityEnds": "", "validFrom": "2026-04-04", "url": "https://allevents.in/hong-kong/2026-intl-conference-embedded-systems-mobile-communication-and-computing/100001913374658109", "price": 0, "name": "General Admission" } ], "organizer": [ { "@type": "Organization", "name": "Aischolar", "url": "https://allevents.in/org/aischolar/26708523", "description": "AiScholar has collaborated with universities, research institutes, governments and enterprises to organize international academic conferences across various disciplines. With nearly 3,000 conferences held since 2014, AiScholar's efforts have been successful in bringing together over 33,000 experts from 2,000 global universities and research institutes through its online cloud platform; about 1.8 million customers have been attracted from universities and research institutes worldwide. The conferences cover a wide range of mainstream disciplines such as energy and environment, water conservancy and civil engineering, electronic information engineering, bioengineering, computer science, earth science, mechanical automation, materials and manufacturing technology, economic management and finance, as well as humanities and social sciences." } ] } ] ```